Invention Grant
- Patent Title: Method for forming porous PTFE layer
- Patent Title (中): 形成多孔PTFE层的方法
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Application No.: US13031274Application Date: 2011-02-21
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Publication No.: US08092629B2Publication Date: 2012-01-10
- Inventor: Yasushi Aburatani , Toshikiyo Komazawa , Tatsuo Takamure
- Applicant: Yasushi Aburatani , Toshikiyo Komazawa , Tatsuo Takamure
- Applicant Address: JP Tokyo
- Assignee: Nippon Valqua Industries, Ltd.
- Current Assignee: Nippon Valqua Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2006-295753 20061031
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A method for forming a porous PTFE layer includes steps of: combining one or at least two unburned porous PTFE films and a support body that can withstand a heating condition in the following process (a rod or plate shaped support body made of mesh or the like is preferable) by using a predetermined means in such a manner that a slip can be prevented in a heating treatment in the following process; and heating the matter resulted from the above process at a temperature of at least 150° C. and less than the melting point of the PTFE film for the range of 5-120 minutes (preferably at a temperature in the range of the melting point of a thermoplastic resin fiber to 320° C. for the range of 10-60 minutes in the case in which the thermoplastic resin fiber or the like is used in the process).
Public/Granted literature
- US20110139343A1 Method for Forming Porous PTFE Layer Public/Granted day:2011-06-16
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