Invention Grant
- Patent Title: Semiconductive seamless belt
- Patent Title (中): 半导体无缝带
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Application No.: US12442019Application Date: 2006-09-21
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Publication No.: US08092718B2Publication Date: 2012-01-10
- Inventor: Yoshinori Watanabe
- Applicant: Yoshinori Watanabe
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- International Application: PCT/JP2006/318768 WO 20060921
- International Announcement: WO2008/035426 WO 20080327
- Main IPC: H01B1/12
- IPC: H01B1/12 ; G03G15/00
Abstract:
The present invention provides a semiconductive seamless belt, which is obtained from a polyamide acid solution containing a tertiary amine having a boiling point of 200° C. or higher and an acid dissociation constant pKa of 4 to 9.
Public/Granted literature
- US20100019206A1 SEMICONDUCTIVE SEAMLESS BELT Public/Granted day:2010-01-28
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