Invention Grant
- Patent Title: Method of forming suspension object on monolithic substrate
- Patent Title (中): 在单片基板上形成悬浮物的方法
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Application No.: US12816231Application Date: 2010-06-15
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Publication No.: US08093085B2Publication Date: 2012-01-10
- Inventor: Siew Seong Tan
- Applicant: Siew Seong Tan
- Applicant Address: TW Hsinchu
- Assignee: Memsor Corporation
- Current Assignee: Memsor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of forming a suspension object on a monolithic substrate is provided. A silicon base layer of the monolithic substrate has a circuit layer composed of at least one wet etching region, at least one circuit region, and at least one microstructure region. The wet etching region is used to partition the circuit region and the microstructure region, and extends downwards to a surface of the silicon base layer, so as to form an etching path for etching the silicon base layer from above the substrate. Next, an upper surface and a lower surface of the silicon base layer are respectively etched through dry etching, such that the microstructure region is suspended.
Public/Granted literature
- US20110306158A1 METHOD OF FORMING SUSPENSION OBJECT ON MONOLITHIC SUBSTRATE Public/Granted day:2011-12-15
Information query
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