Method for manufacturing display device

Invention Grant

US08093112B2 Method for manufacturing display device 有权

Title translation: 显示装置制造方法

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Patent Title: Method for manufacturing display device
Patent Title (中): 显示装置制造方法
Application No.: US12219018

Application Date: 2008-07-15
Publication No.: US08093112B2

Publication Date: 2012-01-10
Inventor: Hidekazu Miyairi , Yasuhiro Jinbo , Kosei Nei
Applicant: Hidekazu Miyairi , Yasuhiro Jinbo , Kosei Nei
Applicant Address: JP Atsugi-shi, Kanagawa-ken
Assignee: Semiconductor Energy Laboratory Co., Ltd.
Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
Agency: Robinson Intellectual Property Law Office, P.C.
Agent Eric J. Robinson
Priority: JP2007-190236 20070720
Main IPC: H01L21/84
IPC: H01L21/84

Abstract:

A method for manufacturing display devices including thin film transistors with high reliability in a high yield is provided. A gate insulating film is formed over a gate electrode; a microcrystalline semiconductor is formed over the gate insulating film; the microcrystalline semiconductor film is irradiated with a laser beam from the surface side thereof, whereby the crystallinity of the microcrystalline semiconductor film is improved. Then, a thin film transistor is formed using the microcrystalline semiconductor film whose crystallinity is improved. Further, a display device including the thin film transistor is manufactured.

Abstract(Chinese):

提供了一种以高产率制造包括具有高可靠性的薄膜晶体管的显示装置的方法。在栅电极上形成栅极绝缘膜; 在栅极绝缘膜上形成微晶半导体; 微晶半导体膜从其表面侧照射激光束，从而提高微晶半导体膜的结晶度。然后，使用结晶度提高的微晶半导体膜形成薄膜晶体管。此外，制造包括薄膜晶体管的显示装置。

Public/Granted literature

US20090023236A1 Method for manufacturing display device Public/Granted day:2009-01-22

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/84	.....衬底不是半导体的，例如绝缘体