Invention Grant
- Patent Title: Method for forming a vertical transistor having tensile layers
- Patent Title (中): 用于形成具有拉伸层的垂直晶体管的方法
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Application No.: US12329190Application Date: 2008-12-05
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Publication No.: US08093127B2Publication Date: 2012-01-10
- Inventor: Eun Sung Lee
- Applicant: Eun Sung Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0000313 20080102
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A vertical transistor includes a semiconductor substrate provided with a pillar type active pattern over the surface thereof. A first tensile layer is formed over the semiconductor substrate and around the lower end portion of the pillar type active pattern, and a second tensile layer is formed over the upper end portion of the pillar type active pattern so that a tensile stress is applied in a vertical direction to the pillar type active pattern. A first junction region is formed within the surface of the semiconductor substrate below the first tensile layer and the pillar type active pattern. A gate is formed so as to surround at least a portion of the pillar type active pattern. A second junction region is formed within the upper end portion of the pillar type active pattern.
Public/Granted literature
- US20090166725A1 VERTICAL TRANSISTOR AND METHOD FOR FORMING THE SAME Public/Granted day:2009-07-02
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