Invention Grant
- Patent Title: Method for forming thin film, substrate having transparent electroconductive film and photoelectric conversion device using the substrate
- Patent Title (中): 用于形成薄膜的方法,具有透明导电膜的基板和使用该基板的光电转换装置
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Application No.: US10497367Application Date: 2002-12-03
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Publication No.: US08093490B2Publication Date: 2012-01-10
- Inventor: Akira Fujisawa , Yukio Sueyoshi , Masahiro Hirata , Toru Yamamoto , Koichiro Kiyohara , Kiyotaka Ichiki
- Applicant: Akira Fujisawa , Yukio Sueyoshi , Masahiro Hirata , Toru Yamamoto , Koichiro Kiyohara , Kiyotaka Ichiki
- Applicant Address: JP Tokyo
- Assignee: Nippon Sheet Glass Company, Limited
- Current Assignee: Nippon Sheet Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2001-368352 20011203; JP2001-368662 20011203; JP2002-293095 20021004; JP2002-293096 20021004
- International Application: PCT/JP02/12620 WO 20021203
- International Announcement: WO03/048411 WO 20030612
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
The present invention provides a thin film-forming method by which, even when a thin film containing a crystalline metal oxide as the main component is formed over a wide area within a short time utilizing a thermal decomposition method, the thickness of the thin film becomes relatively uniform. A thin film-forming method of the present invention includes forming a thin film using a raw material containing a chloride of a metal, and prior to the forming of the thin film, 1) disposing metal-containing particles on the substrate, or 2) forming, at a film deposition rate slower than a film deposition rate for the thin film, a metal-containing thin film on the substrate, and wherein, in the case of the step 2), the thin film containing the metal oxide as the main component is directly formed on the metal-containing thin film.
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