Invention Grant
- Patent Title: Printed wiring board and method for producing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12420469Application Date: 2009-04-08
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Publication No.: US08093507B2Publication Date: 2012-01-10
- Inventor: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP10-272799 19980928; JP10-276010 19980929; JP10-276011 19980929; JP10-290450 19981013; JP10-310445 19981030; JP10-351572 19981210; JP10-354733 19981214; JP10-372274 19981228; JP11-106184 19990414; JP11-187418 19990701
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.
Public/Granted literature
- US20090205857A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME Public/Granted day:2009-08-20
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