Invention Grant
US08093509B2 Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function 有权
具有抗EMI功能的灵活薄型图像感应模块,具有抗EMI功能的灵活薄型PCB模块

  • Patent Title: Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
  • Patent Title (中): 具有抗EMI功能的灵活薄型图像感应模块,具有抗EMI功能的灵活薄型PCB模块
  • Application No.: US12457347
    Application Date: 2009-06-09
  • Publication No.: US08093509B2
    Publication Date: 2012-01-10
  • Inventor: Chi-Hsing Hsu
  • Applicant: Chi-Hsing Hsu
  • Applicant Address: TW Taipei
  • Assignee: Azurewave Technologies, Inc.
  • Current Assignee: Azurewave Technologies, Inc.
  • Current Assignee Address: TW Taipei
  • Agency: Rosenberg, Klein & Lee
  • Priority: TW98111647A 20090408
  • Main IPC: H05K9/00
  • IPC: H05K9/00
Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
Abstract:
A flexible thin image-sensing module with anti-EMI function includes a flexible substrate unit, an electronic element unit, an anti-EMI unit, and a conductive structure. The electronic element unit has a plurality of electronic elements disposed on a top surface of the flexible substrate unit, and the electronic elements at least include an image sensor, a low dropout regulator and a backend IC. The anti-EMI unit is disposed on a bottom surface of the flexible substrate unit. The conductive structure passes through the flexible substrate unit and is electrically connected between the electronic element unit and the anti-EMI unit in order to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit.
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