Invention Grant
- Patent Title: Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
- Patent Title (中): 电子部件,电子部件的制造方法,电子部件组装体和电子设备
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Application No.: US11892139Application Date: 2007-08-20
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Publication No.: US08093616B2Publication Date: 2012-01-10
- Inventor: Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
- Applicant: Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2006-322460 20061129
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
Public/Granted literature
Information query
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