Invention Grant
US08093616B2 Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device 有权
电子部件,电子部件的制造方法,电子部件组装体和电子设备

Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
Abstract:
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
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