Invention Grant
US08093617B2 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
有权
裸露的微电子芯片设置有形成用于构成柔性机械支撑件，制造工艺和微结构的线元件的壳体的凹部
- Patent Title: Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
- Patent Title (中): 裸露的微电子芯片设置有形成用于构成柔性机械支撑件，制造工艺和微结构的线元件的壳体的凹部
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Application No.: US12310246Application Date: 2007-06-21
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Publication No.: US08093617B2Publication Date: 2012-01-10
- Inventor: Dominique Vicard , Bruno Mourey , Jean Brun
- Applicant: Dominique Vicard , Bruno Mourey , Jean Brun
- Applicant Address: FR Paris
- Assignee: Commissariat à l'Energie Atomique
- Current Assignee: Commissariat à l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0607588 20060829
- International Application: PCT/FR2007/001034 WO 20070621
- International Announcement: WO2008/025889 WO 20080306
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.
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