Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US12521428Application Date: 2007-12-26
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Publication No.: US08093619B2Publication Date: 2012-01-10
- Inventor: Masaki Hayashi
- Applicant: Masaki Hayashi
- Applicant Address: JP Anan-shi, Tokushima
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi, Tokushima
- Agency: Squire, Sanders & Dempsey (US) LLP
- Priority: JP2006-353669 20061228
- International Application: PCT/JP2007/074892 WO 20071226
- International Announcement: WO2008/081794 WO 20080710
- Main IPC: H01L33/62
- IPC: H01L33/62

Abstract:
A light emitting device, which can be efficiently manufactured and maintain a stable light emitting property for a long period, is provided. The light emitting device comprises a first resin forming body including a periphery that forms a recess to house a light emitting element and a bottom that forms a bottom portion of the recess, and a second resin forming body which covers the light emitting element. The first resin forming body is composed of a thermosetting epoxy resin composite whose essential component is an epoxy resin. The bottom covers surfaces of lead frames excluding mounting regions of the light emitting element and wires. A thickness of the bottom is formed thinner than a thickness from the surface of the lead frames to a leading end of the light emitting element.
Public/Granted literature
- US20100314654A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-12-16
Information query
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