Invention Grant
- Patent Title: High fill-factor avalanche photodiode
- Patent Title (中): 高填充因子雪崩光电二极管
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Application No.: US11354799Application Date: 2006-02-15
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Publication No.: US08093624B1Publication Date: 2012-01-10
- Inventor: Matthew J. Renzi , Brian F. Aull , Robert K. Reich , Bernard B. Kosicki
- Applicant: Matthew J. Renzi , Brian F. Aull , Robert K. Reich , Bernard B. Kosicki
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agent Theresa A. Lober
- Main IPC: H01L31/107
- IPC: H01L31/107

Abstract:
A photodiode is provided by the invention, including an n-type active region and a p-type active region. A first one of the n-type and p-type active regions is disposed in a semiconductor substrate at a first substrate surface. A second one of the n-type and p-type active regions includes a high-field zone disposed beneath the first one of the active regions at a first depth in the substrate, a mid-field zone disposed laterally outward of the first active region at a second depth in the substrate greater than the first depth, and a step zone connecting the high-field zone and the mid-field zone in the substrate.
Information query
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