The present invention comprises a semiconductor chip, and a semiconductor device having a plurality of semiconductor chips, that enables ESD protection from another semiconductor chip without increasing the chip area in case the semiconductor chip is Multi-Chip-Packaged, without wasting chip area in case the semiconductor chip is not Multi-Chip-Packaged. The exemplary semiconductor chip of the present invention includes an internal circuit and a first electrode pad electrically connected to a ground bus line of the first semiconductor chip in a region where an electrode pad, which gives and receives electric signals required for an operation of the internal circuit, cannot be provided.