Invention Grant
- Patent Title: Attachment member for semiconductor sensor device
- Patent Title (中): 半导体传感器装置的附件
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Application No.: US11772272Application Date: 2007-07-02
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Publication No.: US08093689B2Publication Date: 2012-01-10
- Inventor: Wolfgang Stadler , Harald Gossner , Reinhold Gaertner
- Applicant: Wolfgang Stadler , Harald Gossner , Reinhold Gaertner
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Infineon Technologies AG Patent Department
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A semiconductor sensor device is electrically coupled to an object. An attachment member attaches the semiconductor sensor device to the object. The attachment member comprises a first conductive contact region and a second conductive contact region. An insulating portion is electrically isolates the semiconductor sensor device from the first conductive contact region and second conductive contact region.
Public/Granted literature
- US20090012439A1 Attachment Member for Semiconductor Sensor Device Public/Granted day:2009-01-08
Information query
IPC分类:
