Invention Grant
US08093706B2 Mounting structure of semiconductor device and electronic apparatus using same
失效
使用其的半导体器件和电子设备的安装结构
- Patent Title: Mounting structure of semiconductor device and electronic apparatus using same
- Patent Title (中): 使用其的半导体器件和电子设备的安装结构
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Application No.: US12409796Application Date: 2009-03-24
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Publication No.: US08093706B2Publication Date: 2012-01-10
- Inventor: Shinji Watanabe , Takao Yamazaki
- Applicant: Shinji Watanabe , Takao Yamazaki
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-080371 20080326
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L23/34 ; H01L29/40
Abstract:
A mounting structure includes: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is structured to be wrapped by the flexible wiring board, the mounting structure is provided with outer electrodes on both sides of the flexible wiring board, one side being a side where outer terminals of the semiconductor device are formed, and the other side being an opposite side thereof. At least one wiring layer is formed on the flexible wiring board. A supporting member is provided covering side faces and a surface of the semiconductor device opposite to the side where the outer terminals are formed and protruding from the side faces of the semiconductor device and extending toward the surface on which the outer terminals are formed.
Public/Granted literature
- US20090243075A1 MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING SAME Public/Granted day:2009-10-01
Information query
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