A system-in-package includes a package carrier; a first semiconductor die having a die face and a die edge, the first semiconductor die being assembled face-down to a chip side of the package carrier; a second semiconductor die mounted alongside of the first semiconductor die; a rewiring laminate structure comprising a re-routed metal layer between the first semiconductor die and the package carrier. At least a portion of the re-routed metal layer projects beyond the die edge. A plurality of bumps are arranged on the rewiring laminate structure for electrically connecting the first semiconductor die with the package carrier.