Invention Grant
US08093882B2 Low heat dissipation I/O module using direct drive buck converter
有权
低散热I / O模块采用直接驱动降压转换器
- Patent Title: Low heat dissipation I/O module using direct drive buck converter
- Patent Title (中): 低散热I / O模块采用直接驱动降压转换器
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Application No.: US12870048Application Date: 2010-08-27
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Publication No.: US08093882B2Publication Date: 2012-01-10
- Inventor: Dale R. Terdan , Xiaofan Chen
- Applicant: Dale R. Terdan , Xiaofan Chen
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Boyle Fredrickson, S.C.
- Agent R. Scott Speroff; John M. Miller
- Main IPC: H02M3/156
- IPC: H02M3/156
Abstract:
A current-loop output circuit for an industrial controller provides for low power dissipation and reduced part count by driving current loads of different resistances directly from a switched voltage source. Proper filtering and design of a feedback loop allows the necessary transient response times to be obtained.
Public/Granted literature
- US20100320990A1 Low Heat Dissipation I/O Module Using Direct Drive Buck Converter Public/Granted day:2010-12-23
Information query
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