Invention Grant
- Patent Title: Method of characterizing a semiconductor device and semiconductor device
- Patent Title (中): 表征半导体器件和半导体器件的方法
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Application No.: US12478776Application Date: 2009-06-05
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Publication No.: US08093916B2Publication Date: 2012-01-10
- Inventor: Yue-Shiun Lee , Yuan-Chang Liu , Cheng-Hsiung Chen
- Applicant: Yue-Shiun Lee , Yuan-Chang Liu , Cheng-Hsiung Chen
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp,
- Current Assignee: United Microelectronics Corp,
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/02 ; G21C17/00

Abstract:
A method of characterizing semiconductor device includes providing a silicon-on-insulator (SOI) substrate with at least a body-tied (BT) SOI device and a BT dummy device for measurement, respectively measuring tunneling currents (Igb) and scattering parameters (S-parameters) of the BT SOI device and the BT dummy device, subtracting Igb of BT dummy device from that of the BT SOI device to obtain Igb of a floating body (FB) SOI device, filtering characteristics of the BT dummy device out to extract S-parameters of the FB SOI device, and analyzing the S-parameters of the FB SOI device to obtain gate-related capacitances of the FB SOI device.
Public/Granted literature
- US20100315115A1 METHOD OF CHARACTERIZING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Public/Granted day:2010-12-16
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