Invention Grant
US08094187B2 Method of placing a component by means of a placement device at a desired position on a substrate holder, and device suitable for performing such a method
有权
通过放置装置将部件放置在基板保持器上的期望位置的方法以及适于执行这种方法的装置
- Patent Title: Method of placing a component by means of a placement device at a desired position on a substrate holder, and device suitable for performing such a method
- Patent Title (中): 通过放置装置将部件放置在基板保持器上的期望位置的方法以及适于执行这种方法的装置
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Application No.: US10515125Application Date: 2003-05-20
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Publication No.: US08094187B2Publication Date: 2012-01-10
- Inventor: Henricus T. J. A. G. van der Sanden , Josephus M. M. van Gastel
- Applicant: Henricus T. J. A. G. van der Sanden , Josephus M. M. van Gastel
- Applicant Address: NL Eindhoven
- Assignee: Assembleon N.V.
- Current Assignee: Assembleon N.V.
- Current Assignee Address: NL Eindhoven
- Agency: Foley & Lardner LLP
- Priority: EP02077002 20020522
- International Application: PCT/IB03/02139 WO 20030520
- International Announcement: WO03/098990 WO 20031127
- Main IPC: H04N7/18
- IPC: H04N7/18
Abstract:
A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.
Public/Granted literature
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