Invention Grant
- Patent Title: Printed board and bus bar assembly
- Patent Title (中): 印刷板和母线组件
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Application No.: US11892600Application Date: 2007-08-24
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Publication No.: US08094461B2Publication Date: 2012-01-10
- Inventor: Masahiro Tagano , Teruyuki Kitahara
- Applicant: Masahiro Tagano , Teruyuki Kitahara
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-270550 20061002
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.
Public/Granted literature
- US20080080154A1 Printed board and method for producing the printed board Public/Granted day:2008-04-03
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