Invention Grant
- Patent Title: High frequency tuner module and tuner module
- Patent Title (中): 高频调谐器模块和调谐器模块
-
Application No.: US11998136Application Date: 2007-11-28
-
Publication No.: US08094462B2Publication Date: 2012-01-10
- Inventor: Shozo Miyamoto , Makoto Abe
- Applicant: Shozo Miyamoto , Makoto Abe
- Applicant Address: JP Tama-Shi
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tama-Shi
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2007-013464 20070124
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
Disclosed is a high frequency tuner module, including: a circuit component; signal lines; a GND line; and a multilayer board formed by laminating a plurality of layers, wherein the circuit component is placed on a top layer surface of the multilayer board; the signal lines and the GND line are formed inside the multilayer board; and among the signal lines, high frequency signal transmitting signal lines to transmit a high frequency signal are formed on a single layer inside the multilayer board.
Public/Granted literature
- US20080174982A1 High frequency tuner module and tuner module Public/Granted day:2008-07-24
Information query