Invention Grant
- Patent Title: Semiconductor laser device
- Patent Title (中): 半导体激光器件
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Application No.: US12572323Application Date: 2009-10-02
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Publication No.: US08094696B2Publication Date: 2012-01-10
- Inventor: Yuichiro Okunuki
- Applicant: Yuichiro Okunuki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2009-074678 20090325
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser according to the present invention comprises a λ/2 dielectric film (λ:in-medium wavelength of a dielectric film, for example, SiO2, Si3N4, Al2O3, and AIN) in contact with an facet of a resonator; and a first dielectric double layered film disposed on the dielectric film, which includes a first layer of a-Si and a second layer of a material having a refractive index lower than that of a-Si. The first layer has a thickness) ¼ of a in-medium wavelength of a-Si, and the second layer has a thickness ¼ of a in-medium wavelength of the second layer. Therefore, it is possible to firmly stack the first dielectric double layered film and form a high reflectance film with high yield.
Public/Granted literature
- US20100246623A1 SEMICONDUCTOR LASER DEVICE Public/Granted day:2010-09-30
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