Invention Grant
- Patent Title: Headset
- Patent Title (中): 耳机
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Application No.: US11893883Application Date: 2007-08-16
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Publication No.: US08094852B2Publication Date: 2012-01-10
- Inventor: Michihito Ikuma , Yasuhisa Kaneda
- Applicant: Michihito Ikuma , Yasuhisa Kaneda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Frommer Lawrence & Haug LLP
- Agent William S. Frommer; Ellen Marcie Emas
- Priority: JPP2006-223047 20060818
- Main IPC: H04R25/00
- IPC: H04R25/00
Abstract:
A headset for using an electronic device worn on a head, includes an ear clip formed to have a shape conforming to and wearable on a root of auricle. The ear clip includes a core that can plastically be deformed according to a difference between shapes of the root of auricle and a protecting material that covers the core.
Public/Granted literature
- US20080044051A1 Headset Public/Granted day:2008-02-21
Information query
