Invention Grant
- Patent Title: Crack measuring method and apparatus
- Patent Title (中): 裂纹测量方法和装置
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Application No.: US12476874Application Date: 2009-06-02
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Publication No.: US08094922B2Publication Date: 2012-01-10
- Inventor: Jung-Ju Lee , Won-Seock Kim
- Applicant: Jung-Ju Lee , Won-Seock Kim
- Applicant Address: KR Daejeon
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR Daejeon
- Agency: Global IP Counselors, LLP
- Priority: KR10-2008-0052402 20080604
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines.
Public/Granted literature
- US20090303469A1 CRACK MEASURING METHOD AND APPARATUS Public/Granted day:2009-12-10
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