Invention Grant
- Patent Title: Wafer containing cassette inspection device and method
- Patent Title (中): 晶圆盒检测装置及方法
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Application No.: US12517145Application Date: 2007-12-04
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Publication No.: US08094923B2Publication Date: 2012-01-10
- Inventor: Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
- Applicant: Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
- Applicant Address: JP Yokohama-shi
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2006-331235 20061207
- International Application: PCT/JP2007/073379 WO 20071204
- International Announcement: WO2008/069191 WO 20080612
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A wafer containing cassette inspection device that expresses external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device and a processing unit which processes an image signal from the imaging device. The processing unit includes: reference image generation means; image-to-be-inspected information generation means which generates image-to-be-inspected information; image correction means which performs a process for obtaining a predetermined image from the reference image information on the image-to-be inspected information; and means which generates external view attribute information expressing external view attributes of the inspection object portions according to the corrected image information.
Public/Granted literature
- US20100074514A1 WAFER CONTAINING CASSETTE INSPECTION DEVICE AND METHOD Public/Granted day:2010-03-25
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