Invention Grant
US08095016B2 Bidirectional, optical transmitting/receiving module, optical transmitting/receiving device, and bidirectional optical transmitting/receiving module manufacturing method 失效
双向,光发射/接收模块,光发射/接收设备和双向光发射/接收模块的制造方法

  • Patent Title: Bidirectional, optical transmitting/receiving module, optical transmitting/receiving device, and bidirectional optical transmitting/receiving module manufacturing method
  • Patent Title (中): 双向,光发射/接收模块,光发射/接收设备和双向光发射/接收模块的制造方法
  • Application No.: US12016345
    Application Date: 2008-01-18
  • Publication No.: US08095016B2
    Publication Date: 2012-01-10
  • Inventor: Hiroaki Chida
  • Applicant: Hiroaki Chida
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2007-020127 20070130; JP2008-003194 20080110
  • Main IPC: H04B10/00
  • IPC: H04B10/00
Bidirectional, optical transmitting/receiving module, optical transmitting/receiving device, and bidirectional optical transmitting/receiving module manufacturing method
Abstract:
To provide a low-cost and fine-property bidirectional optical transmitting/receiving module and the like, which include a de-multiplexing device that uses a V-letter shaped optical waveguide and a dielectric multilayer filter. Formation of an end face where the dielectric multilayer film is formed and separation of optical modules are performed in separate steps, and the end face at the intersection of the V-letter shaped optical waveguide, on which the dielectric multilayer filter is formed, is formed by dry etching to achieve high smoothness. Further, a cutting face of the optical module is set at a position that is isolated from the end face at least by 3 μm. Through the above, the smooth end face is protected from roughness of the cutting face caused by a light emitting element separating step, and the dielectric multilayer filter is formed on that end face.
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