A method for remanufacturing an electronic assembly allows the assembly to be disassembled, tested and reassembled despite certain components being permanently affixed to a housing of the assembly. The electronic assembly includes a circuit assembly within the housing. During remanufacture, a first portion of the housing is removed to expose a first side of the circuit assembly and a second portion of the housing is removed to expose a second side of the circuit assembly. When removing the second portion of the housing, one of the components of the circuit assembly may also be removed. During remanufacture a connector assembly including a replacement component substantially similar to the removed component, and including one or more pins connected to the replacement component and situated to mate with one or more empty sockets of the circuit assembly is used to facilitate testing of the assembly.