Invention Grant
US08096348B2 Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment 有权
热交换器,热交换器的制造方法,液体冷却系统,光源装置,投影仪,电子装置单元和电子设备

  • Patent Title: Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
  • Patent Title (中): 热交换器,热交换器的制造方法,液体冷却系统,光源装置,投影仪,电子装置单元和电子设备
  • Application No.: US11538602
    Application Date: 2006-10-04
  • Publication No.: US08096348B2
    Publication Date: 2012-01-17
  • Inventor: Kunihiko TakagiAkira Egawa
  • Applicant: Kunihiko TakagiAkira Egawa
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2005-292192 20051005; JP2006-025761 20060202
  • Main IPC: F28F3/14
  • IPC: F28F3/14 F28F3/12 F28F7/00
Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
Abstract:
A method of manufacturing a heat exchanger having a plurality of fine flow channels includes forming a plurality of thin plate members into a predetermined shape, and laminating the plurality of thin plate members and bonding by diffusion bonding.
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