Invention Grant
- Patent Title: Method of reworking electrical short in ultra sonic bonder
- Patent Title (中): 超音速焊接机电气短路方法
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Application No.: US12433445Application Date: 2009-04-30
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Publication No.: US08096462B2Publication Date: 2012-01-17
- Inventor: Nia W. Fong , Tack Loong Low
- Applicant: Nia W. Fong , Tack Loong Low
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Steven L. Bennett
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K37/00
Abstract:
A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.
Public/Granted literature
- US20100276472A1 METHOD OF REWORKING ELECTRICAL SHORT IN ULTRA SONIC BONDER Public/Granted day:2010-11-04
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