Invention Grant
- Patent Title: Wiring method and device
- Patent Title (中): 接线方法和装置
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Application No.: US11793290Application Date: 2004-12-29
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Publication No.: US08096463B2Publication Date: 2012-01-17
- Inventor: Giovanni Delrosso
- Applicant: Giovanni Delrosso
- Applicant Address: CA Ottawa, Ontario
- Assignee: MOSAID Technologies Incorporated
- Current Assignee: MOSAID Technologies Incorporated
- Current Assignee Address: CA Ottawa, Ontario
- Agent Don R Mollick
- International Application: PCT/EP2004/014802 WO 20041229
- International Announcement: WO2006/069589 WO 20060706
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K37/04

Abstract:
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.
Public/Granted literature
- US20080302858A1 Wiring Method and Device Public/Granted day:2008-12-11
Information query
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