Invention Grant
- Patent Title: Solder-bearing articles and method of retaining a solder mass along a side edge thereof
- Patent Title (中): 焊料制品和沿其侧边保持焊料质量的方法
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Application No.: US12303083Application Date: 2007-05-31
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Publication No.: US08096464B2Publication Date: 2012-01-17
- Inventor: James Zanolli , Joseph Cachina
- Applicant: James Zanolli , Joseph Cachina
- Applicant Address: US RI Warwick
- Assignee: Teka Interconnection Systems
- Current Assignee: Teka Interconnection Systems
- Current Assignee Address: US RI Warwick
- Agency: Weingarten, Schurgin, Gagnebin & Lebovici LLP
- International Application: PCT/US2007/070048 WO 20070531
- International Announcement: WO2007/140448 WO 20071206
- Main IPC: B23K35/14
- IPC: B23K35/14
Abstract:
A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.
Public/Granted literature
- US20100067209A1 SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS ALONG A SIDE EDGE THEREOF Public/Granted day:2010-03-18
Information query
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