Invention Grant
- Patent Title: Temperature compensation for full-width arrays write heads
- Patent Title (中): 全宽阵列温度补偿写入头
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Application No.: US11856456Application Date: 2007-09-17
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Publication No.: US08096634B2Publication Date: 2012-01-17
- Inventor: Douglas Wiggins
- Applicant: Douglas Wiggins
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B41J29/38
- IPC: B41J29/38
Abstract:
A method and system for compensating for temperature changes is disclosed that includes a mounting bar, a plurality of imaging chips adaptively mounted on the mounting bar, each imaging chip including a plurality of imaging elements, and a temperature determiner to determine a temperature of the mounting bar. A control module enables and disables at least one imaging element based on the determined temperature of the mounting bar.
Public/Granted literature
- US20090073252A1 TEMPERATURE COMPENSATION FOR FULL-WIDTH ARRAYS WRITE HEADS Public/Granted day:2009-03-19
Information query
IPC分类:
