Invention Grant
US08096639B2 Mounting arrangement with a support and pressure plate for a printhead assembly
有权
具有用于打印头组件的支撑和压力板的安装布置
- Patent Title: Mounting arrangement with a support and pressure plate for a printhead assembly
- Patent Title (中): 具有用于打印头组件的支撑和压力板的安装布置
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Application No.: US12114799Application Date: 2008-05-04
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Publication No.: US08096639B2Publication Date: 2012-01-17
- Inventor: Kia Silverbrook , Norman Micheal Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant: Kia Silverbrook , Norman Micheal Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Researtch Pty Ltd
- Current Assignee: Silverbrook Researtch Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/15

Abstract:
The invention provides for a mounting arrangement for a printhead assembly having a plurality of modular printhead tiles each having a plurality of micro-electromechanical nozzle arrangements for printing on a printing medium. Each tile has a flex PCB with which to provide the tile with electrical energy. The mounting arrangement includes a support defining retaining clips and channels operatively housing electrical busbars, as well as a pressure plate defining holes shaped and dimensioned to complementarily receive the retaining clips to engage the support which urges the flex PCBs against the busbars to provide electrical power to printhead tiles.
Public/Granted literature
- US20080211869A1 Mounting arrangement with a support and pressure plate for a printhead assembly. Public/Granted day:2008-09-04
Information query
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