Invention Grant
- Patent Title: Fine-structure transfer apparatus and method
- Patent Title (中): 精细结构转移装置及方法
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Application No.: US12711377Application Date: 2010-02-24
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Publication No.: US08096800B2Publication Date: 2012-01-17
- Inventor: Kyoichi Mori , Naoaki Yamashita , Noritake Shizawa , Koji Tsushima
- Applicant: Kyoichi Mori , Naoaki Yamashita , Noritake Shizawa , Koji Tsushima
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, P.C.
- Priority: JP2009-045623 20090227
- Main IPC: A01J21/00
- IPC: A01J21/00
Abstract:
A fine-structure transfer apparatus includes a stamper, a stage on which to place a transfer element having a coating of resist, and a device for heating the resist coating to be vaporized or a device for supplying a vapor of the resist into a space between the stamper and the transfer element.
Public/Granted literature
- US20100219548A1 FINE-STRUCTURE TRANSFER APPARATUS AND METHOD Public/Granted day:2010-09-02
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