Invention Grant
US08096812B2 Chip socket assembly and chip file assembly for semiconductor chips
失效
用于半导体芯片的芯片插座组件和芯片文件组件
- Patent Title: Chip socket assembly and chip file assembly for semiconductor chips
- Patent Title (中): 用于半导体芯片的芯片插座组件和芯片文件组件
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Application No.: US11231640Application Date: 2005-09-20
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Publication No.: US08096812B2Publication Date: 2012-01-17
- Inventor: Donald V. Perino , Wayne S. Richardson , John B. Dillon
- Applicant: Donald V. Perino , Wayne S. Richardson , John B. Dillon
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
The socket releasably couples a packaged integrated circuit to a circuit board. The socket includes a clamp, a latch, and an array interconnect. The clamp is configured to be pivotally coupled to a circuit board. The latch is configured to be coupled to the circuit board and configured to releasably hold the clamp in a predetermined position. The array interconnect configured to be coupled to the printed circuit board. In use the latch releasably holds the hinged clamp in the predetermined position to clamp both a packaged integrated circuit between the clamp and the array interconnect, and the array interconnect between the packaged integrated circuit and the circuit board.
Public/Granted literature
- US20060014402A1 Chip socket assembly and chip file assembly for semiconductor chips Public/Granted day:2006-01-19
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