Invention Grant
US08096812B2 Chip socket assembly and chip file assembly for semiconductor chips 失效
用于半导体芯片的芯片插座组件和芯片文件组件

Chip socket assembly and chip file assembly for semiconductor chips
Abstract:
The socket releasably couples a packaged integrated circuit to a circuit board. The socket includes a clamp, a latch, and an array interconnect. The clamp is configured to be pivotally coupled to a circuit board. The latch is configured to be coupled to the circuit board and configured to releasably hold the clamp in a predetermined position. The array interconnect configured to be coupled to the printed circuit board. In use the latch releasably holds the hinged clamp in the predetermined position to clamp both a packaged integrated circuit between the clamp and the array interconnect, and the array interconnect between the packaged integrated circuit and the circuit board.
Information query
Patent Agency Ranking
0/0