Invention Grant
- Patent Title: Connector with electromagnetic conduction mechanism
- Patent Title (中): 带电磁传导机构的连接器
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Application No.: US12540066Application Date: 2009-08-12
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Publication No.: US08096834B2Publication Date: 2012-01-17
- Inventor: Chih-Ming Lai , Yung-Shun Kao
- Applicant: Chih-Ming Lai , Yung-Shun Kao
- Applicant Address: TW Taipei
- Assignee: Giga-Byte Technology Co., Ltd.
- Current Assignee: Giga-Byte Technology Co., Ltd.
- Current Assignee Address: TW Taipei
- Agent Chun-Ming Shih
- Main IPC: H01R13/648
- IPC: H01R13/648
Abstract:
A connector to be disposed within a housing of an electronic device includes a main body and a conduction member. The conduction member includes a connecting portion and a resilient portion. The resilient portion is formed on the connecting portion and configured to abut against the housing.
Public/Granted literature
- US20110039447A1 CONNECTOR WITH ELECTROMAGNETIC CONDUCTION MECHANISM Public/Granted day:2011-02-17
Information query
