Invention Grant
- Patent Title: Header assembly for implantable medical devices
- Patent Title (中): 可植入医疗器械的头部组件
-
Application No.: US12717732Application Date: 2010-03-04
-
Publication No.: US08096838B2Publication Date: 2012-01-17
- Inventor: Farshid Dilmaghanian
- Applicant: Farshid Dilmaghanian
- Applicant Address: US CA Foothill Ranch
- Assignee: Bal Seal Engineering, Inc.
- Current Assignee: Bal Seal Engineering, Inc.
- Current Assignee Address: US CA Foothill Ranch
- Agency: Klein, O'Neill & Singh, LLP
- Main IPC: H01R24/04
- IPC: H01R24/04
Abstract:
A header assembly for an implantable medical device (IMD). The header assembly includes a plurality of cavities with a plurality of insulating rings interdisposed between adjacent ones of the cavities. The cavities receive electrical contact rings. In certain embodiments, the insulating rings are formed integrally with a body of the header assembly.
Public/Granted literature
- US20100233896A1 HEADER ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICES Public/Granted day:2010-09-16
Information query
