The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%≦Ni+Fe≦90% (provided that 0≦Fe/(Ni+Fe)≦0.4), 1%≦Cr≦25%, 2%≦Si+B≦15% (provided that 0≦B/(Si+B)≦0.8), and 0.1%≦P≦8%.