Invention Grant
- Patent Title: Housing apparatus for heat generating device
- Patent Title (中): 发热装置用壳体装置
-
Application No.: US11711039Application Date: 2007-02-27
-
Publication No.: US08096861B2Publication Date: 2012-01-17
- Inventor: Koichiro Hanafusa
- Applicant: Koichiro Hanafusa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-064792 20060309
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; A47F3/04

Abstract:
According to one embodiment, a housing apparatus for a heat generating device includes a housing being provided with sidewalls arranged sideward to separate from each other, and shelf members placed at a plurality of positions along the sidewalls between the sidewalls. The shelf members support a plurality of devices including a heat generating device, and each sidewall has a plurality of ventilation openings corresponding to the devices held by the shelf members. A duct member is provided on at least outermost sidewall to correspond to at least two adjacent ventilation openings in the outermost sidewall. An airflow producing unit is provided in the duct member and includes at least two airflow producing devices performing one of supplying outside air into the inside of the housing and evacuating the inside air from the housing through the at least two adjacent ventilation openings.
Public/Granted literature
- US20070211429A1 Housing apparatus for heat generating device Public/Granted day:2007-09-13
Information query