Invention Grant
- Patent Title: Percutaneous spinal implants and methods
- Patent Title (中): 经皮脊髓植入物和方法
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Application No.: US11693500Application Date: 2007-03-29
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Publication No.: US08096995B2Publication Date: 2012-01-17
- Inventor: Andrew C. Kohm , Hugues F. Malandain
- Applicant: Andrew C. Kohm , Hugues F. Malandain
- Applicant Address: CH Neuchatel
- Assignee: Kyphon Sarl
- Current Assignee: Kyphon Sarl
- Current Assignee Address: CH Neuchatel
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
An apparatus includes a first elongate member, a second elongate member and a connector. The second elongate member is movably disposed within a distal end portion of the first elongate member. The second elongate member is configured to engage an inner member of an implant disposed within an outer member of the implant. The connector is disposed at the distal end portion of the first elongate member and is configured to releasably connect the distal end portion of the first elongate member to the outer member of the implant.
Public/Granted literature
- US20080071376A1 PERCUTANEOUS SPINAL IMPLANTS AND METHODS Public/Granted day:2008-03-20
Information query
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