Invention Grant
- Patent Title: Method of cutting single crystals
- Patent Title (中): 单晶切割方法
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Application No.: US12271245Application Date: 2008-11-14
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Publication No.: US08097080B2Publication Date: 2012-01-17
- Inventor: Ralf Hammer , Manfred Jurisch
- Applicant: Ralf Hammer , Manfred Jurisch
- Applicant Address: DE Freiberg
- Assignee: Freiberger Compound Materials GmbH
- Current Assignee: Freiberger Compound Materials GmbH
- Current Assignee Address: DE Freiberg
- Agency: Foley & Lardner LLP
- Priority: DE102007056115 20071115
- Main IPC: C30B33/00
- IPC: C30B33/00

Abstract:
A method of dividing single crystals, particularly of plates of parts thereof, is proposed, which can comprise: pre-adjusting the crystallographic cleavage plane (2′) relative to the cleavage device, setting a tensional intensity (K) by means of tensional fields (3′, 4′), determining an energy release rate G(α) in dependence from a possible deflection angle (α) from the cleavage plane (2′) upon crack propagation, controlling the tensional fields (3′, 4′) such that the crack further propagates in the single crystal, wherein G(0)≧2γe(0) and simultaneously at least one of the following conditions is satisfied: ∂ G ∂ α α = 0 ≤ 2 β e h if ∂ 2 G ∂ α 2 ≤ 0 or ( 2.1 ) ∂ G ∂ α ≤ 2 β e h ∀ α : α 1
Public/Granted literature
- US20090283761A1 METHOD OF CUTTING SINGLE CRYSTALS Public/Granted day:2009-11-19
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