Invention Grant
- Patent Title: Cu-Ti-based copper alloy sheet material and method of manufacturing same
- Patent Title (中): Cu-Ti系铜合金板材及其制造方法
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Application No.: US12314281Application Date: 2008-12-08
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Publication No.: US08097102B2Publication Date: 2012-01-17
- Inventor: Weilin Gao , Hisashi Suda , Hiroto Narieda , Akira Sugawara
- Applicant: Weilin Gao , Hisashi Suda , Hiroto Narieda , Akira Sugawara
- Applicant Address: JP Tokyo
- Assignee: Dowa Metaltech Co., Ltd.
- Current Assignee: Dowa Metaltech Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C22C9/00

Abstract:
Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 μm. I{420}/I0{420}>1.0 (1) I{220}/I0{220}≦3.0 (2)
Public/Granted literature
- US20100139822A1 Cu-Ti-based copper alloy sheet material and method of manufacturing same Public/Granted day:2010-06-10
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