Invention Grant
- Patent Title: Method of adjusting mold thickness of toggle-type mold clamping device
- Patent Title (中): 肘型夹紧装置的模具厚度调整方法
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Application No.: US12832273Application Date: 2010-07-08
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Publication No.: US08097193B2Publication Date: 2012-01-17
- Inventor: Takashi Hakoda , Isamu Yamaguchi , Takemi Uehara , Susumu Morozumi
- Applicant: Takashi Hakoda , Isamu Yamaguchi , Takemi Uehara , Susumu Morozumi
- Applicant Address: JP Nagano-Ken
- Assignee: Nissei Plastic Industrial Co., Ltd
- Current Assignee: Nissei Plastic Industrial Co., Ltd
- Current Assignee Address: JP Nagano-Ken
- Agency: Knoble Yoshida & Dunleavy, LLC
- Priority: JP2009-171919 20090723
- Main IPC: B29C45/80
- IPC: B29C45/80

Abstract:
There are provided a first process T1 in which a mold clamping motor 4 is driven-controlled so as to move a cross head 5h of a toggle link mechanism 5 to a preliminary position Xr set in advance so as to become a position on the mold open side rather than a mold closure position Xs; a second process T2 in which after the first process T1 is finished, a mold thickness adjusting motor 2 is driven-controlled so as to move a pressure receiving platen 3 forward to a mold closed position Xc where a mold C is closed; a third process T3 in which after the second process T2 is finished, the mold clamping motor 4 is driven-controlled so as to move the cross head 5h forward, while the mold C is pressurized by torque limitation of the mold clamping motor 4, and the mold thickness adjusting motor 2 is driven-controlled so as to move the pressure receiving platen 3, while the cross head 5h is moved to the mold closure position Xs; and a fourth process T4 in which, after the third process T3 is finished, a clamping margin Lp of the mold C corresponding to a predetermined mold clamping force is set.
Public/Granted literature
- US20110018157A1 METHOD OF ADJUSTING MOLD THICKNESS OF TOGGLE-TYPE MOLD CLAMPING DEVICE Public/Granted day:2011-01-27
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