Invention Grant
- Patent Title: Method of making a damper component
- Patent Title (中): 制造阻尼器部件的方法
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Application No.: US12164205Application Date: 2008-06-30
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Publication No.: US08097194B2Publication Date: 2012-01-17
- Inventor: Daniel Boss
- Applicant: Daniel Boss
- Applicant Address: US IL Elk Grove Village
- Assignee: Material Sciences Corporation
- Current Assignee: Material Sciences Corporation
- Current Assignee Address: US IL Elk Grove Village
- Agency: Berenato & White, LLC
- Main IPC: B29C43/28
- IPC: B29C43/28
Abstract:
A method for making a damper component for absorbing and dissipating vibration and/or noise resonation is provided. The method features heating a laminate including a viscoelastomer-containing damper layer and an adjacent melt-flowable, curable sheet molding compound. Heating is conducted under pressure in a mold to cure the sheet molding compound to form a continuous constraining layer that intimately contacts and encases the damper layer.
Public/Granted literature
- US20090001631A1 Method of making a damper component Public/Granted day:2009-01-01
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