Invention Grant
- Patent Title: Method of making nanoparticles by electroless plating
- Patent Title (中): 通过无电镀制造纳米颗粒的方法
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Application No.: US12038088Application Date: 2008-02-27
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Publication No.: US08097295B2Publication Date: 2012-01-17
- Inventor: Donald Keith Roper , Wonmi Ahn , Benjamin Jeppson Taylor , Analía G. Dall'Asén
- Applicant: Donald Keith Roper , Wonmi Ahn , Benjamin Jeppson Taylor , Analía G. Dall'Asén
- Applicant Address: US UT Salt Lake City
- Assignee: The University of Utah Research Foundation
- Current Assignee: The University of Utah Research Foundation
- Current Assignee Address: US UT Salt Lake City
- Agency: Foley & Lardner LLP
- Main IPC: B05D5/12
- IPC: B05D5/12

Abstract:
A plurality of gold nanoparticles disposed on a surface of a substrate includes nanoparticles having an average particle density greater than 1.8×1011 particles per squared centimeter of the surface. The gold nanoparticles include a monomodal diameter distribution and an average diameter capable of being arbitrarily controlled between about 5 nm to about 300 nm. The surface may be a three-dimensional surface or an internal surface.
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