Exemplary embodiments provide a fuser member containing an interfacial layer and methods for forming the interfacial layer and the fuser member. In one embodiment, the fuser member can include a substrate, a resilient layer, a surface layer and an interfacial layer disposed between the resilient layer and the surface layer. The resilient layer can include, for example, a silicone rubber layer and the surface layer can include, for example, a fluoropolymer such as a fluoroplastic of PFA or PTFE. The interfacial layer can include a diamond-containing polymer composite to provide improved thermal/electrical/mechanical properties. The surface layer and the fuser member can thus be treated at a temperature of about 250° C. or higher with high quality and an improved adhesion between layers of the fuser member.