Invention Grant
- Patent Title: In-mold label, and labeled resin-labeled article
- Patent Title (中): 模内标签和标记树脂标签的物品
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Application No.: US11597285Application Date: 2005-05-20
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Publication No.: US08097338B2Publication Date: 2012-01-17
- Inventor: Mitsuhiro Ashikaga , Naohide Ando , Yasuo Iwasa
- Applicant: Mitsuhiro Ashikaga , Naohide Ando , Yasuo Iwasa
- Applicant Address: JP Tokyo
- Assignee: Yupo Corporation
- Current Assignee: Yupo Corporation
- Current Assignee Address: JP Tokyo
- Agency: Browdy and Neimark, PLLC
- Priority: JP2004-151318 20040521
- International Application: PCT/JP2005/009699 WO 20050520
- International Announcement: WO2005/114620 WO 20051201
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B15/04

Abstract:
An in-mold label comprising an olefinic resin substrate layer (A) having a wetting index (α) of from 34 to 74 mN/m and a heat-sealable resin layer (B) with an antistatic layer having a wetting index (β) of from 30 to 54 mN/m, wherein the absolute value of the initial frictional charge voltage of the substrate layer (A) relative to a sheet offset printing blanket is from 0 kV to 15 kV. This label has good workability in printing, cutting and blanking even in a low-humidity environment.
Public/Granted literature
- US20080254275A1 In-Mold Label, and Labeled Resin-Labeled Article Public/Granted day:2008-10-16
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