Invention Grant
- Patent Title: Electronic device housing
- Patent Title (中): 电子设备外壳
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Application No.: US12949942Application Date: 2010-11-19
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Publication No.: US08097344B2Publication Date: 2012-01-17
- Inventor: Chwan-Hwa Chiang , Qi-Jian Du
- Applicant: Chwan-Hwa Chiang , Qi-Jian Du
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH(Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH(Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910312293 20091225
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
An electronic device housing is provided. The electronic device housing includes a substrate, a metallic coating formed on the substrate, and a top paint coating formed on the metallic coating. The top paint coating contains nano-titanium dioxide powder. The top paint coating has a self-cleaning property. It can oxygenize and clean off dust and sweat accumulated on the surface of the electronic device housing.
Public/Granted literature
- US20110159275A1 ELECTRONIC DEVICE HOUSING Public/Granted day:2011-06-30
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