Disclosed are embodiments of a design and manufacturing system and an associated method that allow for design analysis and for insertion, during wafer manufacture, of intra-process monitoring circuitry. These embodiments use a library of pre-qualified intra-process monitoring circuits and a cross-correlation table that links different monitoring circuits with different IC chip components. Specifically, these embodiments analyze integrated circuit chip design data to identify the components designed into the chip. Then, one or more intra-process monitoring circuits are selected from the library and the design data is modified to include the selected monitoring circuit(s).