Invention Grant
US08097478B2 Method for producing light-emitting diode 有权
发光二极管的制造方法

  • Patent Title: Method for producing light-emitting diode
  • Patent Title (中): 发光二极管的制造方法
  • Application No.: US12666192
    Application Date: 2008-06-26
  • Publication No.: US08097478B2
    Publication Date: 2012-01-17
  • Inventor: Takashi Hodota
  • Applicant: Takashi Hodota
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2007-171920 20070629
  • International Application: PCT/JP2008/061654 WO 20080626
  • International Announcement: WO2009/004980 WO 20090108
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method for producing light-emitting diode
Abstract:
The present invention provides a method for producing a light-emitting diode, the method comprising a lamination step of forming a laminated semiconductor layer by sequentially laminating an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer onto a substrate, as well as forming a plurality of reflective p-type electrodes on top of the p-type semiconductor layer, a plating step of forming a seed layer that covers the reflective p-type electrodes and the p-type semiconductor layer, and fowling a plating layer on top of the seed layer, a removal step of removing the substrate from the n-type semiconductor layer, thereby exposing a light extraction surface of the n-type semiconductor layer, and an electrode formation step of performing dry etching of the light extraction surface of the n-type semiconductor layer using an etching gas containing the same element as a dopant element within the n-type semiconductor layer, and subsequently forming an n-type electrode on the light extraction surface.
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